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High Speed Wire Bonder HW582 for LED Product
This HW582 LED high-speed wire bonder is mainly designed for small BTO end LED products, with a cycle time of 40ms/wire. Applicable to variable wire materials: gold/alloy/copper wire. Taking fine wire bonding to new levels of productivity and efficiency. Fully automated, thermosonic high-speed, ball-and-stitch fine wire bonder capable of ball bumping and customized looping profiles.
With high UPH, based on the brand-new design high-speed and high rigidity XY platform brings customers fast, precision, and stable experience.
Develop fast loop mode for the LED industry, UPH comprehensively improved, supports customers with various complex looping types, easy and fast installation.
Equipped with a new high-speed PR algorithm, the recognition efficiency and recognition speed are increased by 30% compared with the last generation.
Brand new EFO function design, multi-stage high precision output in EFO stage.
Fast, real-time, accurate and high-precision post bond inspection (PBI).
Brand new structure design, greatly simplified the maintenance and lower the cost, improves customers on site efficiency.
| Capability | Cycle time | 40ms/wire |
Bonding accuracy | ±2μm | |
Wire diameter | Φ15μm-Φ50μm | |
XY Table | Drive Mechanism | Linear motor driven |
XY Resolution | 50nm | |
Bonding area | X:56mm, Y:75mm | |
PR system | 1/3″ CMOS camera | |
Material Handling system | Handling Mechanism | Vertical stack |
No. of magazines | 2-3 | |
Applicable magazine | Length | 100-275mm |
Width | 22-78mm | |
Thickness | 0.07-2.0mm |
Hot Tags: Wire Bonder for LED, Wire Bondder For Led Application, Wird Bonder, China, Custom, Customized, wholesale, discount, manufacturers, factory, suppliers, for sale, quotation, made in China
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