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SMT 3D AOI/ 3D Automated Optical Inspection Machine
The rich algorithm combines 3D, Al, and color feature algorithms to optimize the detection rate of the defects.
Multiple positioning methods to locate the component precisely. Intelligently compensate for board warpage and detect defects on black components on the blackboard.
Adapts to different color PCBs, and effectively detect both black and white boards.
The marble platform, dual-drive, and motion control card ensure industry-leading inspection speed.
Ultra-high range 3D reconstruction technology can measure components up to 35mm in height.
The powerful combination of three-point check software and SPC data analysis quickly
identifies the root cause of defects.
Smart factory solution: realize real-time remote monitoring of the production data and centralized management for multiple production lines, improving process quality and increasing production yield.
Automatic program switch through barcode scanning: auto width adjustment is a standard feature and is achieved by simply reading the PCB’s barcode, also it supports the MES command.
SPC alarm Function allows for real-time monitoring of production quality, providing timely feedback in the event of an abnormal situation. This helps prevent defects from continuing through the process and incurring costs.
Major defects are foolproof.
Model | Cube | Cube-D | Cube-XL | |
Image System | Camera | 12MP industrial camara | ||
Resolution | 15μm | 12μm | 10μm | |
FOV | 60*45mm (12MP, 15μm) | |||
lighting | 4 color ring shape LED | |||
Height measurement method | 4-way projectors | |||
Movement structure | X/Y movement | AC Servo (dual drive) | ||
Platform | Granite | |||
Width adjustment | Automatic | |||
Transport type | Belt | |||
Board loading direction | L to R or R to L | |||
Fixed rail | Single lane: 1st fixed rail; Dual Lane: 1st & 3rd or 1st & 4th fixed rail | |||
Hardware configuration | Operating system | Win10 | ||
Communication | Ethernet, SMEMA | |||
Power | Single phase 220V, 50/60Hz, 5A | |||
Air requirement | 0.4-0.6Mpa | |||
Conveyor height | 900±20mm | |||
Overall size | 1140mm*1360*1620mm | 1310*1360*1620mm | ||
Equipment weight | 1100kg | 1150kg | 1300kg | |
PCB size | Size | 50*60-510*510mm | Single lane:50*60-510*560mm | 50*80-650*610mm |
Thickness | ≤6.0mm | |||
Warping | ±3mm | |||
Component clearance | Top clearance 25-50mm adjustable, bottom clearance 45mm | |||
Clamping edge | 3mm | |||
PCB weight | ≤3kg | |||
Inspection categories | Component | Wrong component, missing, polarity, shift, reverse, damage, IC lead ben, IC lifted lead, foreign material, float, coplanarity, tombstone, etc. | ||
Solder joint | No solder, insufficient solder, open solder, excess solder, solder bridge, solder ball, etc. | |||
Component size | Chip：03015 and above,: LSI: 0.3mm pitch and above; others: odd shape component | |||
Measurable range | 35mm(15μm) | |||
Height resolution | 0.3715μm | |||
inspection speed | 450ms/FOV | |||
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