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Wire Bonder for IC
Wire Bonder for IC Wire Bonder for IC

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Wire Bonder for IC

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Wire bonding machine is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding is generally considered the most cost-effective and flexible interconnect technology.
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HIGHLYWIN established in 2010, we are mainly a design/custom design, engineering, and manufacturing company that sells SMT/AI/peripheral machines, also providing full services support and spare parts selling in SMT field.

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