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High Speed Wire Bonder HW585 for IC
This HW812 high precision die bonder is a high accuracy system for chip-to-chip and chip-to-wafer bonding, on wafers up to 12″. The tool features automated handling of chips and substrates. The cycle time is up to 250ms.
It is compatible with IC frame.
Dual dispensing system utilizing a screw pattern.
High precision linear drive solid crystal binding head, voice coil torque ring to accurately control the solid crystal pressure.
High-precision search chip platform, servo motor-driven chip angle correction system, equipped with 12″ wafer automatic film expansion system.
Adopting dispensing independent control system, more precise control of glue quantity.
Vertical dispensing adopts high-precision grating reading head height measurement, Z-axis linear motor drive, before and after the detection of dispensing using the camera vertical detection mode, to improve the accuracy of the detection of the glue point.
Independent XYZ axis mechanism.
Equip high precision dispensing group.
With drawing glue function.
With before dispensing, after dispensing detection function.
Glue spot size and position automatic compensation function.
Vacuum leakage detection.
Accurate automation equipment improves production efficiency, reduces cost.
Model | HW812 |
UPH | Max 17K |
Accuracy | ±20μm |
Rotation | ±3° |
Chip dimension | 15×15 – 200x200mil |
Max angle correction | ±15° |
Max wafer size | 12″ |
X/Y resolution | 1μm |
Thimble Z stroke | 3mm |
Donder head | Linear motor driven, head rotation |
Chip absorbing pressure | 30-300g |
Fixture length | 110-300mm |
Fixture width | 25-110mm |
Power supply | AC220V 50HZ |
Air supply | 0.5Mpa |
Hot Tags: Die Bonder for Semiconductor, Die Bonder For Semiconductor Application, Die Bonding, China, Custom, Customized, wholesale, discount, manufacturers, factory, suppliers, for sale, quotation, made in China
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